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Hybrid die-attach represents a convergence of advanced SMT and IC technologies. Equipment serving this market must be extremely flexible to bond many different components while applying two or more different epoxies, in a single pass. It must process the smallest to the largest, and also ultra-thin, die. Various single-pass component presentation methods are required and the equipment must work with many different substrate types. Key bond process parameters such as placement accuracy, bond-line thickness, die tilt, epoxy coverage and fillet, must be met.
Aadvanced Flip Chip Bonder by flip-chip-bonder.net
Founded in 1986, Datacon has become a leading partner and solution supplier in the semiconductor industry. We set trends in advanced packaging worldwide. A vital aspect of our corporate philosophy is to provide the best customer support. We place great value on continuously broadening our customer support department, which inturn has enables us to provide customers with specialists at the right time and place.
Advanced Die Attach Solution by die-attach.net
MCM-die-bonder.com is a global leading supplier of production equipment for the back-end market, called die bonders, for the processing of the individual chips required by manufacturers of semiconductors. Datacon also develops and produces production equipment.
Advanced MCM Die Bonder by mcm-die-bonder.com
Most Affordable Widest Coverage of any Spikes Easy to Install and Maintain UV Protected / Sun and Weather Proof; Not affected by Extreme Temperature (-210 deg F to 310 deg F) The #1 Bird Dropping Control Spike Specified by Architects and Government Agencies! Recommended by all Major Animal Rights Groups as "Safe and Effective" Some of our Product Users - *Building Contractors *Building Management *Property Management *Landscape Contractors *Industrial Warehouses *Building Maintenance *Hotels and Motels.
Bird Spike Strips by bird-spikes.net
With its latest Multi-Chip Die Bonding, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm. The 2200 apm Multi Chip Die Bonding is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonding platform, a revolutionary modular system introduced in 1995.The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements.
Buy Flip-Chip-Bonder by die-bonding.net
Cable reels are used for storage, unwinding, and winding of conductive cable or lifting cable. Electric cable reels have contacts for maintaining live power during winding. Reels are devices around which lengthy, continuous items such as cable, wires, paper, etc., are wrapped for transportation or storage. Reels are available as simple storage devices although more advanced styles are self-winding.
Buy Wooden Pallets
Tractor Parts Inc. have a wide range of lawn tractor accessories to fit most types of tractor. These will help make life easier for those extra tasks around the garden. Our replacement tractor decals are high quality decals that are not screen printed as many cheaper versions of decals on the internet are. We have replacement decals for Ford, Massey Ferguson, International Harvester, John Deere, and many other tractor models.
Custom Tractor Decals
We would like to take this opportunity to introduce Datacon Technology AG, a known internationally operating group of companies which develops and produces high-precision machines for the semiconductor industry. A supplier to leading microelectronics companies across the globe. Datacon – your essential technology partner for semiconductor production equipment.
Die Bonding Information by advanced-packaging.info
Innovation, the courage to take risks, forward-looking concepts and strategies - these are the cornerstones of our business philosophy. Following these concepts, Datacon consistently creates innovative, dynamic, customer and market-specific strategies which lead to trendsetting product developments in the back-end assembly field of the Advanced Packaging Market. Providing the best customer support is a vital aspect of our corporate philosophy.
Die-Attach Technology by flexible-die-attach-solutions.com
Datacon Flip Chip Die Bonder, pioneer in its field from the very start, brings to you the ideal system for series production in this highly sophisticated technology at very competitive prices. Those who recognize the needs of tomorrow's world will take an active part in shaping it, and the future will revolve around international markets and global vision. Datacon has built a team of sales professionals and representatives who are fully backed by Datacon's "know-how" to satisfy these needs.
Die-Bonding Service by die-bonder.net
